[1]何万强,陈智栋,光崎尚利.应用锌溶液催化的印制板铜箔化学镀镍[J].常州大学学报(自然科学版),2005,(02):27-29.
　HE Wan -qiang,CHEN Zhi -dong,MITSUZAKI -Naotoshi.Electroless Nickel Deposition on Copper substrate of the PCB by Using Solution of the Zinc Catalyst[J].Journal of Changzhou University(Natural Science Edition),2005,(02):27-29.
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应用锌溶液催化的印制板铜箔化学镀镍()
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常州大学学报(自然科学版)[ISSN:2095-0411/CN:32-1822/N]

卷:
期数:
2005年02期
页码:
27-29
栏目:
出版日期:
2005-06-25

文章信息/Info

Title:
Electroless Nickel Deposition on Copper substrate of the PCB by Using Solution of the Zinc Catalyst
作者:
何万强1 ;  陈智栋1 ;  光崎尚利2
1.江苏工业学院化学工程系, 江苏 常州 213016 ;2.株式会社クオルテック, 日本大阪府554 -0052
Author(s):
HE Wan -qiang1 ;  CHEN Zhi -dong1 ;  MITSUZAKI -Naotoshi2
1 .Department of Chemical Engineering , Jiang su Poly technic University , Changzhou 213016 , China ;2 . Taiyo Techno .Service Co ., Ltd ., Osaka 554 -0052 , Japan
关键词:
化学镀镍; 锌活化; 铜箔表面
Keywords:
electroless nickel plating ; znic solution ; copper substrate
分类号:
T Q 153.1
文献标志码:
A
摘要:
铜箔化学镀镍前表面需要活化, 传统的钯活化液成本较高, 研究了利用锌溶液和锌粉代替钯盐溶液来活化铜箔的表面, 实验确定了活化温度为60 ～ 70 ℃, 处理时间为1 min 。结果表明用锌溶液活化的铜箔表面能成功的化学镀镍, 并且镀镍层有良 好的剥离强度, 因此锌溶液可以代替钯溶液来作为铜箔化学镀镍的活化处理液。
Abstract:
In the paper the zinc solution and zinc pow der were used to activate the surface of copper substrate instead of palladium solution .The required experimental temperature w as 60 ℃ to 70 ℃ and the activation time w as one minute .The experiment results proved that the copper substrate activated by zinc solution could be successfully plated by nickel and the plated surface had perfect peeling intensity .The zinc solution and powder could be used as the substituted activating solution in electroless nickel plating .

参考文献/References:

[1] 蔡积庆.印制板化学镀Au [J] .印制电路信息, 2001 , (2): 51 -53 .
[2] 田代雄彦, 桥本幸雄, 本间英夫.S elect ive Elect roless Ni ckel Deposition on the Copper Fine Pat terns by Using DMAB as a Second Reducing Agent [J] .表面技术, 2001 , 52 :289 -293 .
[3] 王森林, 吴辉煌.玻璃表面的无钯活化化学镀镍[J] .应用 化学, 2003 , 20 (5):491 -492 .
[4] T su ru Y, Mochinaga K .Application of Vapor -Deposited Carbon and Zinc as a Substitute f or Palladium Cat alyst in the Elect roless Plating of Nickel [J] .S urface and Coat ings Technology , 2003 , 169 :116 -119 .
[5] 藤原裕, 夏本英彦, 吉川纯二, 等.Deposition of Zn ont o Cu and Format ion of Zn -Cu Intermetallic Phases by Contact Immersion Method [J] .表面技术, 2001 , 52 :141 -142 .
[6] Fujiw ar Y , Enomoto H .Elect rodeposition of β {sup}′- brass Cyanide Baths wi th Accumulat ive Underpot ent ial Deposition of Zn [J] .J Elect rochem S oc, 2000 , 147 :1 840 -1 846 .

备注/Memo

备注/Memo:
作者简介:何万强(1977 -), 男, 山东德州人, 硕士研究生。
更新日期/Last Update: 2005-06-25