[1]王钰蓉,曹小云,陈 靓,等.温度对浸镀锡镀层的影响[J].常州大学学报(自然科学版),2015,(01):32-36.[doi:10.3969/j.issn.2095-0411.2015.01.006]
　WANG Yu-rong,CAO Xiao-yun,CHEN Liang,et al.Effect of Plating Temperature on Immersion Tin Coating[J].Journal of Changzhou University(Natural Science Edition),2015,(01):32-36.[doi:10.3969/j.issn.2095-0411.2015.01.006]
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温度对浸镀锡镀层的影响()
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常州大学学报(自然科学版)[ISSN:2095-0411/CN:32-1822/N]

卷:
期数:
2015年01期
页码:
32-36
栏目:
材料科学与工程
出版日期:
2015-01-25

文章信息/Info

Title:
Effect of Plating Temperature on Immersion Tin Coating
作者:
王钰蓉1; 曹小云1; 陈 靓1; 何嘉伟1; 光崎尚利2; 包伟良3; 陈智栋1; 4
1.常州大学 石油化工学院,江苏 常州 213164; 2.株式会社クオルテック, 日本 大阪 590-0906; 3.浙江大学 化学系,浙江 杭州 310058; 4.江苏省材料表面技术重点实验室(常州大学),江苏 常州 213164
Author(s):
WANG Yu-rong1;  CAO Xiao-yun 1;  CHEN Liang1;  HE Jia-wei1;  MITSUZAK Naotoshi2;  BAO Wei-liang3; CHEN Zhi-dong1; 4
1.School of Petrochemical Engineering, Changzhou University,Changzhou 213164, China; 2. Qualtec Co., Ltd,Osaka 590-0906,Japan; 3.BAO Wei-liang,Department of Chemistry,Zhejiang University,Hangzhou 310058,China; 4.Key Laboratory of Materials Surface Technology of Jiangsu Province, Changzhou University,Changzhou 213164, China
关键词:
化学镀锡;  晶型;  氯化胆碱;  性能
Keywords:
electroless tin plating;  structure of crystal;  choline chloride;  performance
分类号:
TQ 153.1+3
DOI:
10.3969/j.issn.2095-0411.2015.01.006
文献标志码:
A
摘要:
在基于氯化胆碱-水溶液(ChCl-H2O)的浸镀锡溶液中,以铜片为基材,在不同温度下进行浸镀锡研究。分别利用X-荧光光谱仪、扫描电子显微镜、X-射线衍射仪、可焊性测试仪和电化学工作站,考察了浸镀锡速率、形貌、物相和性能受温度的影响程度。结果表明,随着温度的升高,浸镀锡的沉积速率不断加快,浸镀锡镀层的耐蚀性和可焊性均有提高; 镀层表面在较低温度时光亮平整,但随温度上升,变得越来越粗糙; 在70°C时,锡镀层的晶相组成由Sn和Cu6Sn5两相共存转变Sn、Cu6Sn5和Cu3Sn三相共存。在ChCl-H2O体系中,铜基浸镀锡的反应活化能Ea为24.6 kJ·mol-1。
Abstract:
The present study documents the effect of electroless plating temperature on the deposition rate, morphology, structure and performance, such as solderability and corrosion resistance, of Sn coatings on Cu substrate achieved from ChCl-H2O solution by immersion deposition. The effects were investigated by X-ray spectroscopy, scanning electron microscope, X-ray diffraction, solderability tester and electrochemical workstation, respectively. The results showed that the deposition rate, corrosion resistance and the solderability of the immersion Sn coatings increased with the increasing temperature, the surface was smooth and bright at lower temperature, but turned to be rougher and rougher with the increasing temperature, the Cu-Sn intermetallic phase varied from Cu6Sn5 to Cu3Sn coexisting with Cu6Sn5 at the temperature above 70℃. The activation energy of Sn deposition Ea was calculated to be 24.6 kJ·mol-1.

参考文献/References:

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备注/Memo

备注/Memo:
基金项目:国家自然科学基金项目(51341007,51401038),江苏省高校自然科学研究面上项目(13KYB150004)。 作者简介:王钰蓉(1979-),女,浙江上虞人,博士,讲师,主要从事金属表面处理研究。通讯联系人:陈智栋(1964-),E-mail:chen@cczu.edu.cn
更新日期/Last Update: 2015-01-25