[1]李 健,林小平.基于ICEPAK的热管冷板散热肋片的优化设计[J].常州大学学报(自然科学版),2016,(03):75-78.[doi:10.3969/j.issn.2095-0411.2016.03.015]
 LI Jian,LIN Xiaoping.Optimization Design on Radiating Rib of Heat Pipe-Cold Plate Based on ICEPAK[J].Journal of Changzhou University(Natural Science Edition),2016,(03):75-78.[doi:10.3969/j.issn.2095-0411.2016.03.015]
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基于ICEPAK的热管冷板散热肋片的优化设计()
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常州大学学报(自然科学版)[ISSN:2095-0411/CN:32-1822/N]

卷:
期数:
2016年03期
页码:
75-78
栏目:
出版日期:
2016-05-30

文章信息/Info

Title:
Optimization Design on Radiating Rib of Heat Pipe-Cold Plate Based on ICEPAK
作者:
李 健林小平
常州大学 机械工程学院, 江苏 常州 213164
Author(s):
LI Jian LIN Xiaoping
School of Mechanical Engineering, Changzhou University, Changzhou 213164, China
关键词:
ICEPAK 冷板 散热装置 优化设计
Keywords:
ICEPAK cold plate radiating device optimization design
分类号:
TN 305.94
DOI:
10.3969/j.issn.2095-0411.2016.03.015
文献标志码:
A
摘要:
为了有效解决电子设备的多热源、高热流散热问题,研制了基于某雷达电子元器件安装空间尺寸的热管冷板散热装置,利用ICEPAK仿真软件对其进行热仿真分析。通过仿真结果所示的温度云图,对所提出的热管冷板散热装置进行了3种优化设计,以此来更好地解决电子设备散热的核心问题,提高电子器件的工作效率和寿命。同时,对这3种方案进行实验验证,结果表明:菱形截面肋片方案的散热性能和板面均温性良好,能较好地满足设计要求; ICEPAK热仿真软件计算结果与实验验证结果相符合,在热设计阶段具有可行性。
Abstract:
To deal with multi-heat-source and high-heat-flux heat transfer problem of electronic equipment, a heat pipe cold plate equipment is developed, and an analysis of thermal simulation was made using the ICEPAK simulation software. In order to better solve the core problem of the heat radiation of electronic equipment, improve the work efficiency and the service life of electronic devices, 3 kinds of optimization design of the heat pipe cold plate equipment were carried out through the simulation results of temperature contour. At the same time, these three schemes are verified by experiments, the results showed that, the diamond cross section rib scheme has shown a good performance in heat radiation and board temperature uniformity, which can better meet the design requirements; the calculation results of thermal simulation software of ICEPAK can be consistent with the experimental results,and it is feasible in the thermal design stage.

参考文献/References:

[1]FENG Y, WANG Y. Study on copper cold plate designs for electronics liquid cooling system [C]// 2006 ASME International Mechanical Engineering Congress and Exposition. Chicago: ASME, 2006:1-8.
[2]陈洁茹, 朱敏波, 齐颖. Icepak在电子设备热设计中的应用[J].电子机械工程, 2005, 21(1): 14-16.
[3]WU Y L, CHEN M Y, YANG K S,et al. A novel condensate-free refrigerated cold plate for electronic cooling [J]. HVAC & R Research, 2010, 16(1): 3-14.
[4]赵臣烜, 张钰, 张言安. 基于ICEPAK的散热器优化设计[J]. 制造业信息化,2013(6): 124-126.
[5]DAVID B S, DEVARAKONDA A. An experimental study of the thermal performance of heat pipe embedded cold plates for satellite electronic cooling [C]// 35th International Symposium on Microelectronics. Denver: NASA Glenn Research Center, 2002: 778-783.
[6]李玲娜, 蔺佳. 基于ANSYS ICEPAK的密闭机箱散热仿真分析[J]. 光电技术应用, 2012, 27(6): 75-79.
[7]MA Z S, YAO S G. Experimental investigation of a novel heat pipe cold plate for electronics cooling [J]. 2009, 68(10): 861-865.
[8]VENKATESWARLU P. Development of 2kW heat pipe based TWT cooling system [C]//13th International Heat Pipe Conference. Hyderabad: Chaitanya Bharati Institute of Technology, 2004:10-15.
[9]ZHANG B S, PEI Y F, SUN H J,et al. Study on cold plate applied for multi-subassembly thermal vacuum test [J].Spacecraft Environment Engineering, 2009, 26(6): 519-522.
[10]李新. 应用Icepak软件对肋片散热器进行优化设计[J]. 煤矿机械, 2012, 33(6): 49-50.

备注/Memo

备注/Memo:
收稿日期:2015-05-21。基金项目:江苏省产学研联合创新资金-前瞻性联合研究项目资助(BY2014037-24)。作者简介:李健(1963—),男,江苏常州人,硕士,副教授,主要从事特种装备技术研究。
更新日期/Last Update: 2016-05-20