参考文献/References:
[1]FENG Y, WANG Y. Study on copper cold plate designs for electronics liquid cooling system [C]// 2006 ASME International Mechanical Engineering Congress and Exposition. Chicago: ASME, 2006:1-8.
[2]陈洁茹, 朱敏波, 齐颖. Icepak在电子设备热设计中的应用[J].电子机械工程, 2005, 21(1): 14-16.
[3]WU Y L, CHEN M Y, YANG K S,et al. A novel condensate-free refrigerated cold plate for electronic cooling [J]. HVAC & R Research, 2010, 16(1): 3-14.
[4]赵臣烜, 张钰, 张言安. 基于ICEPAK的散热器优化设计[J]. 制造业信息化,2013(6): 124-126.
[5]DAVID B S, DEVARAKONDA A. An experimental study of the thermal performance of heat pipe embedded cold plates for satellite electronic cooling [C]// 35th International Symposium on Microelectronics. Denver: NASA Glenn Research Center, 2002: 778-783.
[6]李玲娜, 蔺佳. 基于ANSYS ICEPAK的密闭机箱散热仿真分析[J]. 光电技术应用, 2012, 27(6): 75-79.
[7]MA Z S, YAO S G. Experimental investigation of a novel heat pipe cold plate for electronics cooling [J]. 2009, 68(10): 861-865.
[8]VENKATESWARLU P. Development of 2kW heat pipe based TWT cooling system [C]//13th International Heat Pipe Conference. Hyderabad: Chaitanya Bharati Institute of Technology, 2004:10-15.
[9]ZHANG B S, PEI Y F, SUN H J,et al. Study on cold plate applied for multi-subassembly thermal vacuum test [J].Spacecraft Environment Engineering, 2009, 26(6): 519-522.
[10]李新. 应用Icepak软件对肋片散热器进行优化设计[J]. 煤矿机械, 2012, 33(6): 49-50.