[1]王世颖,许志刚,王文昌,等.丙烷磺酸吡啶嗡盐在高增量厚径比印花镍网电铸中的应用[J].常州大学学报(自然科学版),2021,33(01):9-14.[doi:10.3969/j.issn.2095-0411.2021.01.002]
　WANG Shiying,XU Zhigang,WANG Wenchang,et al.Application of Pyridinium Propyl Sulfobetaine in Electroforming of Nickel Mesh with High Incremental Aspect Ratio[J].Journal of Changzhou University(Natural Science Edition),2021,33(01):9-14.[doi:10.3969/j.issn.2095-0411.2021.01.002]
点击复制

丙烷磺酸吡啶嗡盐在高增量厚径比印花镍网电铸中的应用()
分享到：

常州大学学报(自然科学版)[ISSN:2095-0411/CN:32-1822/N]

卷:
第33卷
期数:
2021年01期
页码:
9-14
栏目:
材料科学与工程
出版日期:
2021-01-20

文章信息/Info

Title:
Application of Pyridinium Propyl Sulfobetaine in Electroforming of Nickel Mesh with High Incremental Aspect Ratio
文章编号:
2095-0411(2021)01-0009-06
作者:
王世颖1; 许志刚1; 王文昌2; 陈智栋2
(1.常州大学 材料科学与工程学院, 江苏 常州 213164; 2.常州大学 石油化工学院, 江苏 常州 213164)
Author(s):
WANG Shiying1;  XU Zhigang1;  WANG Wenchang2;  CHEN Zhidong2
(1. School of Materials Science and Engineering, Changzhou University, Changzhou 213164, China; 2. School of Petrochemical Engineering, Changzhou University, Changzhou 213164, China)
关键词:
印花镍网;  电铸;  丙烷磺酸吡啶嗡盐(PPS);  增量厚径比;  去极化
Keywords:
nickel mesh;  electroforming;  pyridinium propyl sulfobetaine(PPS);  incremental aspect ratio;  depolarization
分类号:
O 613.52
DOI:
10.3969/j.issn.2095-0411.2021.01.002
文献标志码:
A
摘要:
采用丙烷磺酸吡啶嗡盐(PPS)作为镍网电铸添加剂进行了电铸镍网实验, 通过添加丙烷磺酸吡啶嗡盐来提高镍网的增量厚径比和耐折性。线性伏安扫描结果表明, 丙烷磺酸吡啶嗡盐的去极化作用与镀液的对流有关, 在较小电位的电化学沉积中, 在高对流条件下丙烷磺酸吡啶嗡盐的去极化作用比其在低对流条件下更强, 导致处于强对流的镍网外侧沿厚度方向镍原子的沉积和处于弱对流的网孔内侧沿径向镍原子沉积速度的差异。最终, 在PPS质量浓度为10 mg/L时获得具有高增量厚径比和良好耐折性的镍网。
Abstract:
The electroforming of nickel mesh was performed in Watt bath with different concentration of pyridinium propyl sulfobetaine(PPS)to achieve a higher incremental aspect ratio and better folding resistance. The linear sweep voltammetry demonstrates that the depolarization of PPS is convection related. At more negative potential, the depolarization effect of PPS is stronger under high convection conditions than that under low convection conditions, which results in different deposition of nickel ions along the thickness direction and along diameter direction. The nickel mesh with high incremental aspect ratio and good folding resistance was obtained when the concentration of PPS is 10 mg/L.

参考文献/References:

[1]MCGEOUGH J A, LEU M C, RAJURKAR K P, et al. Electroforming process and application to micro/macro manufacturing[J]. CIRP Annals-Manufacturing Technology, 2001, 50(2): 499-514.
[2]TANG P T, BENZON M E, RASMUSSEN J P, et al. Important parameters and applications for nickel electroforming[C]//Manufacturing and Technology Conference. Cleveland: AESF, 1996: 627-631.
[3]RODRIGUEZ G, BALDWIN D F. Analysis of solder paste release in fine pitch stencil printing processes[J]. Journal of Electronic Packaging, 1999, 121(3): 169-172.
[4]BURKHALTER G, LEAK E, SHEA C, et al. Transfer efficiencies in stencil printing[J]. Surface Mount Technology, 2007, 21(5): 31-33.
[5]DIXIT P, MIAO J. Aspect-ratio-dependent copper electrodeposition technique for very high aspect-ratio through-hole plating[J]. Journal of the Electrochemical Society, 2006, 153(6): 199-207.
[6]WANG C, ZHANG J, YANG P, et al. Through-hole filling by copper electroplating using sodium thiazolinyl-dithiopropane sulfonate as the single additive[J]. International Journal of Electrochemical Science, 2012, 7(11): 10644-10651.
[7]HAZLEBECK D A, TALBOT J B. Modeling of additive effects on the electroplating of a through hole[J]. Aiche Journal, 2010, 36(8): 1145-1155.
[8]LEE J M, WEST A C. Impact of pulse parameters on current distribution in high aspect ratio vias and through-holes[J]. Journal of the Electrochemical Society, 2005, 152(10): C645-C651.
[9]BAUDRAND D. Nickel sulfamate plating, its mystique and practicality[J]. Metal Finishing, 1996, 94(7): 15-18.
[10]DOW W P, CHEN H H, YEN M, et al. Through-hole filling by copper electroplating[J]. Journal of the Electrochemical Society, 2008, 155(12): D750-D757.
[11]PASQUALE M A, GASSA L M, ARVIA A J. Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives[J]. Electrochimica Acta, 2008, 53(20): 5891-5904.
[12]翟安民. 一种高目数高开孔率印刷圆网的制作方法: 104087978A[P]. 2014-10-08.
[13]杨守昌. 镍圆网电解液用添加剂: 1737204[P]. 2006-02-22.
[14]孙俊成, 魏福彬, 张光德, 等. 一种高目数印刷圆网制作方法:101284438[P]. 2008-10-15.
[15]YAN J J, CHANG L C, LU C W, et al. Effects of organic acids on through-hole filling by copper electroplating[J]. Electrochimica Acta, 2013, 109: 1-12.
[16]许志刚, 王世颖, 王文昌, 等. 噻唑啉基二硫代丙烷磺酸钠对印花镍网开孔率的影响[J]. 电镀与精饰, 2018, 40(5): 11-14.
[17]WANG S Y, XU Z G, WANG W C, et al. A comparative study on 2-Aminoethanethiol and l-Cysteine as new additives for electroforming nickel mesh[J]. Electrochim Acta, 2018, 282: 728-734.

备注/Memo

备注/Memo:
收稿日期:2020-09-22。
基金项目:国家自然科学青年基金资助项目(51601020)。
作者简介:王世颖(1985—),女,内蒙古赤峰人,博士,讲师。E-mail: shiying_wang@cczu.edu.cn
更新日期/Last Update: 2021-01-20