参考文献/References:
[1] ZHU Y Q, CHEN B, QIN M, et al. 2-D micromachined thermal wind sensors-a review[J]. IEEE Internet of Things Journal, 2014, 1(3): 216-232.
[2] BRUSCHI P, DILIGENTI A, NAVARRINI D, et al. A double heater integrated gas flow sensor with thermal feedback[J]. Sensors and Actuators A: Physical, 2005, 123/124: 210-215.
[3] LIU C, HUANG J B. A micromachined flow shear-stress sensor based on thermal transfer principles[J]. Journal of Microelectromechanical Systems: A Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems, 1999, 8(1): 90-99.
[4] YE Y Z, YI Z X, GAO S X, et al. Effect of insulation trenches on micromachined silicon thermal wind sensors[J]. IEEE Sensors Journal, 2017, 17(24): 8324-8331.
[5] YE Y Z, YI Z X, GAO S X, et al. DRIE trenches and full-bridges for improving sensitivity of 2-D micromachined silicon thermal wind sensor[J]. Journal of Microelectromechanical Systems, 2017, 26(5): 1073-1081.
[6] CUBUKCU A S, ZERNICKEL E, BUERKLIN U, et al. A 2D thermal flow sensor with sub-mW power consumption[J]. Sensors and Actuators A: Physical, 2010, 163(2): 449-456.
[7] ZHU Y Q, CHEN B, GAO D, et al. A robust and low-power 2-D thermal wind sensor based on a glass-in-silicon reflow process[J]. Microsystem Technologies, 2016, 22(1): 151-162.
[8] HOURDAKIS E, SARAFIS P, NASSIOPOULOU A G. Novel air flow meter for an automobile engine using a Si sensor with porous Si thermal isolation[J]. Sensors(Basel, Switzerland), 2012, 12(11): 14838-14850.
[9] BREVET W, SEBASTIANO F, MAKINWA K. A 25 mW smart CMOS wind sensor with corner heaters[C]//IECON 2015-41st Annual Conference of the IEEE Industrial Electronics Society. Yokohama: IEEE, 2015: 1194-1199.
[10] SABATÉ N, SANTANDER J, FONSECA L, et al. Multi-range silicon micromachined flow sensor[J]. Sensors and Actuators A: Physical, 2004, 110(1/2/3): 282-288.
[11] ZHU Y Q, QIN M, YE Y Z, et al. Modelling and characterization of a robust, low-power and wide-range thermal wind sensor[J]. Microsystem Technologies, 2017, 23(12): 5571-5585.
[12] CERIMOVIC S, TALIC A, BEIGELBECK R, et al. Bidirectional micromachined flow sensor featuring a hot film made of amorphous germanium[J]. Measurement Science and Technology, 2013, 24(8): 084002.
[13] ASHAUER M, GLOSCH H, HEDRICH F, et al. Thermal flow sensor for liquids and gases based on combinations of two principles[J]. Sensors and Actuators A: Physical, 1999, 73(1/2): 7-13.
[14] WANG S, YI Z X, QIN M, et al. Temperature effects of a ceramic MEMS thermal wind sensor based on a temperature-balanced mode[J]. IEEE Sensors Journal, 2019, 19(17): 7254-7260.
[15] GAO S X, YI Z X, YE Y Z, et al. Temperature effect and its compensation of a micromachined 2-D anemometer[J]. IEEE Sensors Journal, 2019, 19(14): 5454-5459.
[16] HUANG Q G, CHEN B, ZHU Y Q, et al. Modeling of temperature effects on micromachined silicon thermal wind sensors[J]. Journal of Microelectromechanical Systems, 2015, 24(6): 2033-2039.
[17] CHEN B, ZHU Y Q, YI Z X, et al. Temperature effects on the wind direction measurement of 2D solid thermal wind sensors[J]. Sensors(Basel, Switzerland), 2015, 15(12): 29871-29881.
[18] YI Z X, WANG D, QIN M, et al. Encapsulation glue effect of encapsulation glue on micromachined thermal wind sensor[J]. IEEE Sensors Letters, 2018, 2(4): 1-3.
[19] KOWALSKI L, RICART J, JIMÉNEZ V, et al. Thermal modelling of the chip for the REMS wind sensor[J]. International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 2010, 23(4): 340-353.
[20] DALOLA S, CERIMOVIC S, KOHL F, et al. MEMS thermal flow sensor with smart electronic interface circuit[J]. IEEE Sensors Journal, 2012, 12(12): 3318-3328.
[21] SOSNA C, BUCHNER R, LANG W. A temperature compensation circuit for thermal flow sensors operated in constant-temperature-difference mode[J]. IEEE Transactions on Instrumentation and Measurement, 2010, 59(6): 1715-1721.
[22] SHEN G P, QIN M, HUANG Q G. A system-level model for a silicon thermal flow sensor[J]. Microsystem Technologies, 2009, 15(2): 279-285.
[23] ISHIZUKA M, FUKUOKA Y. Application of the thermal network method to the transient thermal analysis of multichip modules[C]//2nd 1998 IEMT/IMC Symposium(IEEE Cat. No.98EX225). Tokyo: IEEE, 1998: 161-166.
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