[1]宋艳,李锦春,张鑫.苯酚-亚联苯型环氧树脂的合成及其在环氧模塑料中的应用[J].常州大学学报(自然科学版),2015,(04):20-25.[doi:10.3969/j.issn.2095-0411.2015.04.004]
　SONG Yan,LI Jinchun,ZHANG Xin.Synthesis of Epoxy Resin with Biphenylene Structure and Its Application in Epoxy Molding Compound[J].Journal of Changzhou University(Natural Science Edition),2015,(04):20-25.[doi:10.3969/j.issn.2095-0411.2015.04.004]
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苯酚-亚联苯型环氧树脂的合成及其在环氧模塑料中的应用()
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常州大学学报(自然科学版)[ISSN:2095-0411/CN:32-1822/N]

卷:
期数:
2015年04期
页码:
20-25
栏目:
材料科学与工程
出版日期:
2015-11-15

文章信息/Info

Title:
Synthesis of Epoxy Resin with Biphenylene Structure and Its Application in Epoxy Molding Compound
作者:
宋艳; 李锦春; 张鑫
常州大学 材料科学与工程学院,江苏 常州 213164
Author(s):
SONG Yan;  LI Jinchun;  ZHANG Xin
School of Materials Science and Engineering, Changzhou University, Changzhou 213164, China
关键词:
苯酚-亚联苯;  酚醛树脂;  环氧树脂;  模塑料
Keywords:
phenol-biphenylene;  novolac resin;  epoxy resin;  molding compound
分类号:
O 633.13
DOI:
10.3969/j.issn.2095-0411.2015.04.004
文献标志码:
A
摘要:
以自制苯酚-亚联苯型酚醛树脂、环氧氯丙烷为主要原料,采用固体碱作为醚化阶段催化剂,合成了一种苯酚-亚联苯型环氧树脂。借助红外光谱(FTIR)、核磁共振光谱(1H NMR 和13C NMR)、凝胶渗透色谱(GPC)分别对产物的结构、组成和分子量进行了表征,结果成功制备了苯酚-亚联苯型环氧树脂,相对分子质量为870,环氧当量为274 g/eq。此外,将所得苯酚-亚联苯型环氧树脂用于环氧模塑料中,并与市售环氧树脂所得的模塑料进行比较,借助热失重分析仪(TGA)、热机械分析仪(TMA)等对模塑料的主要性能进行研究,结果表明含有苯酚-亚联苯型环氧树脂的模塑料具有较长的凝胶时间和流动长度,具有较高的Tg(142 ℃)以及较高的初始降解温度(413 ℃),完全可以满足无铅焊料的加工工艺要求,并具有较好的弯曲强度和弯曲模量。
Abstract:
Epoxy resin with biphenylene structure was synthesized by the reaction between elf-prepared phenol-biphenylene resin and epichlorohydrin using solid sodium hydroxide as etherization catalyst. The product was characterized by Fourier Transform Infrared Spectroscopy(FTIR), Nuclear Magnetic Resonance Spectroscopy(1H NMR and 13C NMR)and Gel Permeation Chromatography(GPC), respectively, and the results showed that phenol-biphenylene epoxy resin was successfully synthesized, and its molecular weight was 870 as well as the epoxy equivalent 274 g/eq.Furthermore, the epoxy resin with biphenylene structure was applied in epoxy molding compound(EMC), and the curred EMC was characterized by thermogravitric analyzer(TGA), thermomechanical analyzer(TMA), and electronic universal testing machine, respectively. Compared with the commercial epoxy resins, the EMC containing self-prepared epoxy resin with biphenylene structure showed longer gelation time and flowing length, and had higher Tg(142 ℃)and initial degradation temperature(413 ℃), which can meet the processing requirement of lead-free solder. Additionally, the EMC had better flexural strength and flexural modulus.

参考文献/References:

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备注/Memo

备注/Memo:
收稿日期:2014-12-29。基金项目:江苏省科学技术厅产学研联合创新基金项目(BY2013024-27)。作者简介:宋艳(1977—),女,安徽蚌埠人,博士,讲师,主要从事精细高分子合成及应用。通讯联系人:李锦春(1965—),E-mail:Lijinchun88@163.com
更新日期/Last Update: 2015-10-20